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NRVBS260T3G - onsemi

Description: Last Shipments - Schottky Power Rectifier, Surface Mount, 2.0 A, 60 V, SMB Package

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Symbol
NRVBS260T3G - onsemi - PCB symbol
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PCB Footprints
NRVBS260T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J_1
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3D Models
NRVBS260T3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J_1
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NRVBS260T3G Details

  • Manufacturer Part Number:

    NRVBS260T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SMB

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    60 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.63 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    60 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVBS260T3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins to protect the device from electrostatic discharge. Follow the recommended PCB layout guidelines for ESD protection devices.
  • Ensure that the input voltage (VIN) is applied before the enable signal (EN) is asserted. Also, ensure that the output voltage (VOUT) is not loaded until the device is fully enabled and the output voltage has stabilized.
  • Use a minimum of 10 μF ceramic capacitor at the input (VIN) and a minimum of 22 μF ceramic capacitor at the output (VOUT). The capacitor values may need to be adjusted based on the specific application requirements.

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NRVBS260T3G Overview

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