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NRVBS360T3G - onsemi

Description: Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max

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Symbol
NRVBS360T3G - onsemi - PCB symbol
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PCB Footprints
NRVBS360T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
NRVBS360T3G - onsemi - 3D model - Diodes Moulded - SMC CASE403-03
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NRVBS360T3G Details

  • Manufacturer Part Number:

    NRVBS360T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.22

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.63 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    125 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVBS360T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ. Monitor the device's thermal performance and adjust the system design as needed.
  • The NRVBS360T3G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.
  • Yes, the NRVBS360T3G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • Use a systematic approach to troubleshoot issues. Check the device's pinout and connections, ensure proper power supply and decoupling, and verify that the device is operated within its recommended specifications. Use oscilloscopes and logic analyzers to debug the circuit. Consult the datasheet and application notes for specific guidance.

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NRVBS360T3G Overview

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