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NRVBSS25FA - onsemi

Description: Low Power Loss, High Efficiency; Guard Ring for Overvoltage Protection; High Surge Current Capability; UL Flammability 94V-0 Classification; MSL 1 per J-STD-020; Green Molding Compound; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified; These Devices are Pb−Free and are RoHS Compliant

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PCB Footprints
NRVBSS25FA - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FA
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3D Models
NRVBSS25FA - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-123FA
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NRVBSS25FA Details

  • Manufacturer Part Number:

    NRVBSS25FA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Package Description:

    SOD-123FL, 2 PIN

  • Manufacturer Package Code:

    425AB

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2020-06-22

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    400 µA

  • Reverse Recovery Time-Max:

    0.009 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVBSS25FA Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the NRVBSS25FA involves placing the device close to the power source, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it is recommended to use a low-ESR capacitor at the input and output pins to reduce noise and improve stability.
  • To ensure proper thermal management of the NRVBSS25FA, it is recommended to provide a heat sink or thermal pad on the top of the device, and to ensure good airflow around the device. The maximum junction temperature of the device is 150°C, and it is recommended to keep the operating temperature below 125°C for optimal performance and reliability.
  • The NRVBSS25FA is rated for an input voltage of up to 25V, but it is recommended to operate the device within the specified input voltage range of 4.5V to 18V for optimal performance and reliability. Exceeding the maximum input voltage can cause damage to the device.
  • The NRVBSS25FA is rated for operation up to 125°C, but it is recommended to derate the device's performance at high temperatures. The device's output current and efficiency may be reduced at high temperatures, and the device's reliability may be affected. It is recommended to consult the datasheet and application notes for more information on high-temperature operation.
  • To troubleshoot issues with the NRVBSS25FA, it is recommended to check the input voltage, output voltage, and output current to ensure they are within the specified ranges. Additionally, check for proper thermal management, and ensure that the device is properly soldered and connected to the PCB. Consult the datasheet and application notes for more information on troubleshooting and fault detection.

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