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NS3L500MTTWG - onsemi

Description: Ethernet LAN Switch, 3 V, 8-Channel, 2:1 Gigabit, with LED Switch

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PCB Footprints
NS3L500MTTWG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN56 5x11
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3D Models
NS3L500MTTWG - onsemi  - 3D model - Quad Flat No-Lead - WQFN56 5x11
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NS3L500MTTWG Details

  • Manufacturer Part Number:

    NS3L500MTTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WQFN56 5x11, 0.5P

  • Package Description:

    5 X 11 MM, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, WQFN-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    510AK

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Normal Position:

    NO

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Off-state Isolation-Nom:

    37 dB

  • On-state Resistance Match-Nom:

    0.4 Ω

  • On-state Resistance-Max (Ron):

    25 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC56,.19X.43,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    35 ns

  • Switch-on Time-Max:

    15 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

NS3L500MTTWG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern is recommended. Refer to the onsemi application note AND9093/D for more details.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • The NS3L500MTTWG has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NS3L500MTTWG is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • Consult the onsemi troubleshooting guide AND9094/D for common issues and solutions. If the issue persists, contact onsemi technical support for further assistance.

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NS3L500MTTWG Overview

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