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NSDEMP11XV6T1G - onsemi

Description: Diode Array 2 Pair Common Anode 80 V 100mA (DC) Surface Mount SOT-563, SOT-666

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PCB Footprints
NSDEMP11XV6T1G - onsemi PCB footprint - Other - Other - SOT−563−6 1.60x1.20x0.55, 0.50P
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NSDEMP11XV6T1G Details

  • Manufacturer Part Number:

    NSDEMP11XV6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-563, 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    463A-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    ULTRA FAST RECOVERY

  • Breakdown Voltage-Min:

    80 V

  • Configuration:

    2 BANKS, COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSDEMP11XV6T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The NSDEMP11XV6T1G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure proper power sequencing and decoupling.
  • Yes, the NSDEMP11XV6T1G is AEC-Q101 qualified and suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and guidelines for these applications.
  • Follow the onsemi recommended soldering profile, and ensure that the device is handled and assembled in a static-protected environment. Use a soldering iron with a temperature-controlled tip and avoid overheating the device.

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NSDEMP11XV6T1G Overview

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Part Image NSDEMN11XV6T5 onsemi

Rectifier Diode, 1 Phase, 4 Element, 0.1A, 80V V(RRM), Silicon