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NSI45030AZT1G - onsemi

Description: Robust Power Package: 1.4 W, Wide operating voltage range, Immediate turn on Voltage surge suppressing protecting LEDs, AEC-Q101 qualified and PPAP Capable, UL94-V0 certified SBT (Self Biased Transistor) Technology, Negative Temperature Coefficient, This device uses Halogen-Free Molding Compound, This is a Pb-Free Device; AEC-Q101 Qualified and PPAP Capable, UL94-V0 Certified

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Symbol
NSI45030AZT1G - onsemi - PCB symbol
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PCB Footprints
NSI45030AZT1G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT−223 (TO−261) CASE 318E−04 ISSUE R
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3D Models
NSI45030AZT1G - onsemi - 3D model - SOT223 (3-Pin) - SOT−223 (TO−261) CASE 318E−04 ISSUE R
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NSI45030AZT1G Details

  • Manufacturer Part Number:

    NSI45030AZT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223 (TO-261) 4 LEAD

  • Pin Count:

    4

  • Manufacturer Package Code:

    0.0318

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.89

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

NSI45030AZT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND9093/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to maintain a safe junction temperature. Monitor the device's thermal performance and adjust the system design as needed.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to prevent damage from electrostatic discharge. Follow the onsemi application note AND9095/D for ESD protection guidelines.
  • Ensure that the power supplies are sequenced correctly to prevent damage to the device. The recommended power-up sequence is VCC, then VIN. The power-down sequence should be reversed. Refer to the datasheet for specific power sequencing requirements.
  • Follow the onsemi soldering and rework guidelines outlined in the application note AND9094/D. Use a soldering temperature of 260°C (max) and a rework temperature of 240°C (max) to prevent damage to the device.

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NSI45030AZT1G Overview

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