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NSIM-3-C - Same Sky

Description: Nano SIM Card Connectors, 7 Contacts, Connector, Hinged, Surface Mount, 1.35 mm Height Above Board, Gold Flash

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PCB Footprints
NSIM-3-C - Same Sky PCB footprint - Other - Other - NSIM-3-C-2
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3D Models
NSIM-3-C - Same Sky  - 3D model - Other - NSIM-3-C-2
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NSIM-3-C Details

  • Manufacturer Part Number:

    NSIM-3-C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Same Sky

  • Connector Type:

    PCB CONNECTOR

NSIM-3-C Frequently Asked Questions (FAQs)

  • Same Sky recommends a 4-layer PCB with a dedicated ground plane and thermal vias to dissipate heat. A thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
  • To ensure accurate current sensing, use a Kelvin connection to the sense pins, and make sure the sense lines are twisted and shielded to minimize noise. Also, calibrate the current sense amplifier according to the datasheet instructions.
  • The maximum allowed voltage drop across the NSIM-3-C is 100 mV. Exceeding this limit may affect the device's accuracy and reliability.
  • The NSIM-3-C is rated for operation up to 125°C. However, derating is required for temperatures above 85°C. Consult the datasheet for derating curves and thermal management guidelines.
  • Consult the datasheet's troubleshooting section and Same Sky's application notes for guidance on debugging common issues. Also, ensure proper PCB layout, thermal management, and power supply decoupling.

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NSIM-3-C Overview

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About Same Sky

Tracing our roots back to 1989 just outside of Portland, Oregon, Same Sky® (formerly CUI Devices) is an electronic components manufacturer dedicated to nurturing the spirit of innovation by caring more than is expected, embracing evolution, taking a holistic approach, and having fun along the away. We specialize in an ever-expanding range of product technologies, including audio, interconnect, motion, relay, sensor, switch and thermal management solutions.

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