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NSP8818MUTAG - onsemi

Description: 15V Clamp 35A (8/20µs) Ipp Tvs Diode Surface Mount 10-UDFN (3.5x2)

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NSP8818MUTAG - onsemi PCB footprint - Other - Other - UDFN10 3.5x2, 0.575P CASE 506CU ISSUE O
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NSP8818MUTAG - onsemi  - 3D model - Other - UDFN10 3.5x2, 0.575P CASE 506CU ISSUE O
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NSP8818MUTAG Details

  • Manufacturer Part Number:

    NSP8818MUTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-10

  • Package Description:

    UDFN-10

  • Manufacturer Package Code:

    506CU

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    5 V

  • Breakdown Voltage-Min:

    3.2 V

  • Breakdown Voltage-Nom:

    3.5 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    COMMON ANODE, 8 ELEMENTS, 8 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-N10

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    8

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    3 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSP8818MUTAG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Monitor input voltage, output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP) to ensure safe operation.
  • Use a combination of capacitors and inductors to filter the output. Optimize the filter design using simulation tools and consider the output impedance, load characteristics, and desired ripple and noise levels.
  • Use low-ESR capacitors with a minimum capacitance of 10uF for the input and output. Ensure the capacitors are rated for the maximum operating voltage and temperature range.

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