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NSPU5132MUTBG - onsemi

Description: 13.5 V UNIDIRECTIONAL ESD

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PCB Footprints
NSPU5132MUTBG - onsemi PCB footprint - Other - Other - UDFN6, 1.8 x 2, 0.4P CASE 517CS ISSUE O
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3D Models
NSPU5132MUTBG - onsemi  - 3D model - Other - UDFN6, 1.8 x 2, 0.4P CASE 517CS ISSUE O
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NSPU5132MUTBG Details

  • Manufacturer Part Number:

    NSPU5132MUTBG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    UDFN-6

  • Manufacturer Package Code:

    517CS

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2018-06-12

  • Manufacturer:

    onsemi

  • YTEOL:

    7.63

  • Breakdown Voltage-Max:

    17.5 V

  • Breakdown Voltage-Min:

    13.6 V

  • Breakdown Voltage-Nom:

    15.5 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    24 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    4800 W

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    13.5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSPU5132MUTBG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Monitor the device's junction temperature, output current, and input voltage. Implement over-temperature protection, over-current protection, and under-voltage lockout (UVLO) to prevent damage.
  • Use a low-dropout regulator (LDO) or a switching regulator with a low quiescent current. Optimize the PCB layout to minimize power losses and use a low-power mode if available.
  • Implement human body model (HBM) and charged device model (CDM) protection using TVS diodes or ESD protection arrays. Ensure proper PCB layout and handling procedures to prevent ESD damage.

Trust Checks

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NSPU5132MUTBG Overview

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