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NSPU5201MUTBG - onsemi

Description: Unidirectional High Voltage ESD and Surge Protection; Provides ESD Protection to IEC61000−4−2 Level 4: ±30 kV Contact Discharge; Small Package: 1.8 mm x 2.0 mm; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NSPU5201MUTBG - onsemi - PCB symbol
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PCB Footprints
NSPU5201MUTBG - onsemi PCB footprint - Other - Other - UDFN6, 1.8 x 2, 0.4P CASE 517CS ISSUE O
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3D Models
NSPU5201MUTBG - onsemi - 3D model - Other - UDFN6, 1.8 x 2, 0.4P CASE 517CS ISSUE O
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NSPU5201MUTBG Details

  • Manufacturer Part Number:

    NSPU5201MUTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-6

  • Manufacturer Package Code:

    517CS

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.06

  • Breakdown Voltage-Max:

    23.7 V

  • Breakdown Voltage-Min:

    21.7 V

  • Breakdown Voltage-Nom:

    22.7 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    31.5 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSPU5201MUTBG Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias under the device, and a heat sink if possible. The datasheet provides some guidelines, but onsemi also offers a thermal modeling tool to help with custom designs.
  • In addition to following the recommended operating temperature range, ensure proper thermal design, use a heat sink if possible, and consider derating the device's power dissipation at higher temperatures. Also, consult onsemi's application notes for high-temperature operation.
  • The NSPU5201MUTBG has built-in ESD protection diodes, but it's still important to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges, and avoid voltage spikes or transients.
  • The NSPU5201MUTBG is an industrial-grade device, but it's not specifically designed for automotive applications. If you need a device for automotive use, consider onsemi's AEC-Q100 qualified products, which meet the stringent requirements for automotive systems.
  • onsemi provides a recommended soldering profile in their application notes, which includes a peak temperature of 260°C and a dwell time of 30-60 seconds. However, it's always best to consult the specific soldering profile recommended by the PCB manufacturer and the assembly house.

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