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NSR0240MX2T5G - onsemi

Description: Low Forward Voltage Drop: 460 mV @ 100mA; Low Reverse Current: 200 nA @ 25 V VR; Continuous Forward Current: 200 mA; Low Capacitance: 7 pF; X2DFNW2 Wettable Flank DFN Surface Mount Package; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; NSVR Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
NSR0240MX2T5G - onsemi PCB footprint - Other - Other - X2DFN2 1.00x0.60x0.37, 0.65P CASE 714AB ISSUE C
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3D Models
NSR0240MX2T5G - onsemi  - 3D model - Other - X2DFN2 1.00x0.60x0.37, 0.65P CASE 714AB ISSUE C
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NSR0240MX2T5G Details

  • Manufacturer Part Number:

    NSR0240MX2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2020-04-14

  • Manufacturer:

    onsemi

  • YTEOL:

    4.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.3 W

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR0240MX2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation. Additionally, using a thermal interface material (TIM) between the device and the heat sink can improve thermal performance.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design. The device has built-in ESD protection, but additional external protection may be necessary depending on the application.
  • Yes, the NSR0240MX2T5G is suitable for high-reliability and automotive applications. It's manufactured using a robust process, and onsemi provides additional documentation and support for these types of applications. However, it's essential to consult with onsemi's application engineers and follow the recommended design and testing procedures.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage, output voltage, and load current. Check the device's operating conditions, PCB layout, and component selection. Use oscilloscopes and other diagnostic tools to identify any anomalies or oscillations. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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NSR0240MX2T5G Overview

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