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NSR02L30NXT5G - onsemi

Description: Very Low Forward Voltage Drop; Low Reverse Current; Very High Switching Speed

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PCB Footprints
NSR02L30NXT5G - onsemi PCB footprint - Other - Other - DSN2 (0201) CASE 152AA
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3D Models
NSR02L30NXT5G - onsemi  - 3D model - Other - DSN2 (0201) CASE 152AA
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NSR02L30NXT5G Details

  • Manufacturer Part Number:

    NSR02L30NXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DSN2, 0.6x0.3, 0.4P, (0201)

  • Package Description:

    DSN-2

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.58 V

  • JESD-30 Code:

    R-XBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.735 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR02L30NXT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the NSR02L30NXT5G, the maximum voltage is 30V and the maximum current is 2A. Operating within these limits ensures safe and reliable operation.
  • Handle the device by the body or use an ESD wrist strap or mat. Ensure the PCB has ESD protection components, such as TVS diodes or resistors, and follow proper PCB layout guidelines to minimize ESD risk.
  • Store the device in its original packaging or in a dry, cool place. Avoid exposing the device to moisture, extreme temperatures, or physical stress. Handle the device by the body or use an ESD wrist strap or mat.

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NSR02L30NXT5G Overview

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