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NSR0620P2T5G - onsemi

Description: Very Low Forward Voltage Drop 350 mV @ 100 mA; Low Reverse Current 2.0 uA @ 10 V; Continuous Forward Current 500 mA; Power Dissipation with Minimum Trace 190 mW; Very High Switching Speed 4.0 ns @ 10 mA; Low Capacitance 12 pF @ 1.0 V

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NSR0620P2T5G - onsemi - PCB symbol
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PCB Footprints
NSR0620P2T5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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3D Models
NSR0620P2T5G - onsemi - 3D model - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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NSR0620P2T5G Details

  • Manufacturer Part Number:

    NSR0620P2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923, 1.0x0.6, 0.40 Max Height

  • Package Description:

    CASE 514AB-01, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.08

  • Additional Feature:

    IR-NOM

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.52 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.57 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    9 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR0620P2T5G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • A peak reflow temperature of 260°C is recommended, with a dwell time of 20-30 seconds above 220°C. The device should be soldered using a no-clean or water-soluble flux, and the soldering process should be completed within 3 minutes.
  • Handle the device by the body or the pins, avoiding touching the die or wire bonds. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage. Avoid bending or flexing the leads, and ensure that the device is not subjected to mechanical stress during assembly.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C and 30°C, and the relative humidity should be below 60%. Avoid exposing the device to corrosive substances or cleaning solvents.

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NSR0620P2T5G Overview

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