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NSR10F20NXT5G - onsemi

Description: Low Forward Voltage Drop (VF)

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PCB Footprints
NSR10F20NXT5G - onsemi PCB footprint - Other - Other - NSR10F20NXT5G-3
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NSR10F20NXT5G - onsemi  - 3D model - Other - NSR10F20NXT5G-3
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NSR10F20NXT5G Details

  • Manufacturer Part Number:

    NSR10F20NXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DSN2, 1.4x0.6, 0.75P

  • Package Description:

    CASE 152AD-01, DSN2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-XBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    18 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.47 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR10F20NXT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the NSR10F20NXT5G, the SOA is limited by the maximum voltage rating of 20V and the maximum current rating of 10A.
  • Use proper ESD handling procedures, such as wearing an ESD strap, using an ESD mat, and storing the device in an ESD-safe container. Also, ensure that the PCB design includes ESD protection components, such as TVS diodes.
  • A gate drive voltage of 10-15V and a current of 1-2A is recommended for optimal switching performance. However, the specific requirements may vary depending on the application and PCB layout.

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NSR10F20NXT5G Overview

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