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NSR2030QMUTWG - onsemi

Description: Extremely Fast Switching Speed; Low Forward Voltage − 540 mV (Typ) @ IF = 2 A; These Devices are Pb-Free, Halogen Free and are RoHS Compliant

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PCB Footprints
NSR2030QMUTWG - onsemi PCB footprint - Other - Other - UDFN4 3.5x3.5, 1.55P CASE 517DA ISSUE A
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NSR2030QMUTWG - onsemi  - 3D model - Other - UDFN4 3.5x3.5, 1.55P CASE 517DA ISSUE A
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NSR2030QMUTWG Details

  • Manufacturer Part Number:

    NSR2030QMUTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-4

  • Package Description:

    UDFN-4

  • Manufacturer Package Code:

    517DA

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2017-05-05

  • Manufacturer:

    onsemi

  • YTEOL:

    7.35

  • Breakdown Voltage-Min:

    30 V

  • Case Connection:

    CATHODE

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.65 V

  • JESD-30 Code:

    S-PDSO-N4

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    12.5 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    2.08 W

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    20 µA

  • Reverse Recovery Time-Max:

    0.034 µs

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR2030QMUTWG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom of the package. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The NSR2030QMUTWG has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
  • Yes, the NSR2030QMUTWG is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured using a process that ensures high reliability and low defect rates.
  • To troubleshoot issues related to the internal voltage regulator, check the input voltage, output voltage, and current consumption. Ensure that the input voltage is within the recommended range, and the output voltage is within the specified tolerance. Also, verify that the device is not overheating, and the current consumption is within the recommended limits.

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NSR2030QMUTWG Overview

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