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NSR20F20NXT5G - onsemi

Description: Low Forward Voltage Drop (VF)

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NSR20F20NXT5G - onsemi PCB footprint - Other - Other - NSR20F20NXT5G-3
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NSR20F20NXT5G - onsemi  - 3D model - Other - NSR20F20NXT5G-3
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NSR20F20NXT5G Details

  • Manufacturer Part Number:

    NSR20F20NXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DSN2, 1.6x0.8, 0.9P (0603)

  • Package Description:

    DSN-2

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AB

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.42 V

  • JESD-30 Code:

    R-XBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    28 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.56 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    150 µA

  • Reverse Recovery Time-Max:

    0.08 µs

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR20F20NXT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. Ensure a solid ground plane on the bottom layer and a thermal relief pattern on the top layer.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Focus on the device's switching frequency, output voltage ripple, and input voltage noise. Implement a pi-filter or a common-mode choke to minimize EMI emissions.
  • Consult the application note and reference design for the specific application (e.g., automotive, industrial, or consumer). Adjust the component values, layout, and thermal design accordingly.
  • Implement a robust design with adequate margin, follow the recommended PCB layout, and ensure proper thermal management. Perform thorough testing, including environmental and reliability tests, to validate the design.

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NSR20F20NXT5G Overview

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