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NSR20F30NXT5G - onsemi

Description: Very Low Forward Voltage Drop (VF); Low Reverse Current (IR); High ESD Ratings: HMB(3B), MM(C); 2.0 A of continuous forward current

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PCB Footprints
NSR20F30NXT5G - onsemi PCB footprint - Other - Other - DSN2, 1.6x0.8, 0.9P, (0603) CASE 152AB ISSUE B
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3D Models
NSR20F30NXT5G - onsemi  - 3D model - Other - DSN2, 1.6x0.8, 0.9P, (0603) CASE 152AB ISSUE B
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NSR20F30NXT5G Details

  • Manufacturer Part Number:

    NSR20F30NXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DSN2, 1.6x0.8, 0.9P (0603)

  • Package Description:

    DSN-2

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.42 V

  • JESD-30 Code:

    R-XBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    28 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.56 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR20F30NXT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
  • Use an ESD wrist strap or mat when handling the device, and ensure that the PCB has ESD protection circuits, such as TVS diodes or ESD protection arrays, to prevent damage from static electricity.
  • A gate drive voltage of 10-15V is recommended for optimal switching performance, but the device can operate with a gate drive voltage as low as 5V.

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NSR20F30NXT5G Overview

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