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NSV40301MDR2G - onsemi

Description: Current Gain Matching to 10%; Base Emitter Voltage Matched to 2 mV; This is a Pb-Free Device; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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NSV40301MDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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NSV40301MDR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NSV40301MDR2G Details

  • Manufacturer Part Number:

    NSV40301MDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Collector Current-Max (IC):

    3 A

  • Collector-Base Capacitance-Max:

    50 pF

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    180

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.783 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • Turn-off Time-Max (toff):

    890 ns

  • Turn-on Time-Max (ton):

    200 ns

  • VCEsat-Max:

    0.115 V

NSV40301MDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for airflow.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating temperature range, use a heat sink or thermal pad, and consider derating the device's power dissipation according to the datasheet.
  • The NSV40301MDR2G has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or die.
  • The NSV40301MDR2G is an automotive-grade device, but it's essential to review the datasheet and application notes to ensure it meets the specific requirements of your high-reliability or automotive application.
  • To troubleshoot issues, review the datasheet and application notes, check the device's operating conditions, and use debugging tools such as oscilloscopes or logic analyzers to identify the root cause of the problem.

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NSV40301MDR2G Overview

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