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NSVBAS21SLT1G - onsemi

Description: Moisture Sensitivity Level: 1; ESD Rating-Human Body Model: Class 1, Machine Model: Class B; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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PCB Footprints
NSVBAS21SLT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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3D Models
NSVBAS21SLT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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NSVBAS21SLT1G Details

  • Manufacturer Part Number:

    NSVBAS21SLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.625 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.225 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    250 V

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVBAS21SLT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND8325/D for more details.
  • Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Follow the ESD handling precautions outlined in the onsemi ESD Application Note AND8033/D. Use an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag or container.
  • Yes, the NSVBAS21SLT1G is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines to meet the specific application requirements.
  • Consult the onsemi troubleshooting guide AND8341/D for common issues and solutions. Verify the device is operated within the recommended specifications, and check for proper PCB layout, thermal management, and ESD protection.

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