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NSVBAS21TMR6T1G - onsemi

Description: Three BAS21 diodes in a SC-74 package.; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable ; These devices are Pb-free, Halogen free/BFR free and are RoHS compliant.

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PCB Footprints
NSVBAS21TMR6T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC−74 CASE 318F−05
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NSVBAS21TMR6T1G - onsemi  - 3D model - SOT23 (6-Pin) - SC−74 CASE 318F−05
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NSVBAS21TMR6T1G Details

  • Manufacturer Part Number:

    NSVBAS21TMR6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74 (SC-59ML) 6 LEAD

  • Package Description:

    CASE 318F-05, SC-74, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Application:

    HIGH VOLTAGE

  • Breakdown Voltage-Min:

    250 V

  • Configuration:

    SEPARATE, 3 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.625 A

  • Number of Elements:

    3

  • Number of Phases:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.311 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    250 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVBAS21TMR6T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern is recommended. Refer to the onsemi application note AND9176/D for more details.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K to improve heat transfer between the device and the heat sink.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Refer to the onsemi application note AND9177/D for more details.
  • Use a wrist strap or anti-static mat to prevent electrostatic discharge (ESD) damage during handling. Ensure that the device is stored in an anti-static bag or tube to prevent ESD damage during storage and shipping.
  • The recommended operating voltage range for the NSVBAS21TMR6T1G is 1.71V to 1.89V. Operating the device outside of this range may affect its performance and reliability.

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