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NSVBAT54SWT1G - onsemi

Description: Low Forward Voltage 0.35 Volts (Typ) @ IF = 10 mAdc; Extremely Fast Switching Speed; Pb-Free Package is Available; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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PCB Footprints
NSVBAT54SWT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323 (SC-70) CASE 419-04 ISSUE N
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3D Models
NSVBAT54SWT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-323 (SC-70) CASE 419-04 ISSUE N
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NSVBAT54SWT1G Details

  • Manufacturer Part Number:

    NSVBAT54SWT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.8 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.6 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    2 µA

  • Reverse Recovery Time-Max:

    0.005 µs

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVBAT54SWT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ. Monitor the device's thermal performance and adjust the system design as needed.
  • The NSVBAT54SWT1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes or resistors.
  • Yes, the NSVBAT54SWT1G is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended design and manufacturing guidelines to ensure the device meets the required reliability standards.
  • Use an oscilloscope to measure the device's switching waveforms and verify that they meet the datasheet specifications. Check the PCB layout for any signal integrity issues, and ensure that the device is properly decoupled and bypassed. Consult the datasheet and application notes for troubleshooting guidelines.

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