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NSVBCP53-16T3G - onsemi

Description: High Current: 1.5 Amps; NPN Complement is BCP56; The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die; Available in 12 mm Tape and Reel Use BCP53T1G to order the 7 inch/1000 unit reel. Use BCP53T3G to order the 13 inch/4000 unit reel.; Device Marking: BCP53 = AH BCP53-10 = AH-10 BCP53-16 = AH-16; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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NSVBCP53-16T3G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223 ST SUFFIX CASE 318E-04 ISSUE N
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NSVBCP53-16T3G - onsemi  - 3D model - SOT223 (3-Pin) - SOT-223 ST SUFFIX CASE 318E-04 ISSUE N
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NSVBCP53-16T3G Details

  • Manufacturer Part Number:

    NSVBCP53-16T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4D

  • Package Description:

    TO-261, SOT-223, 4 PIN

  • Manufacturer Package Code:

    0.0318

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1.5 A

  • Collector-Emitter Voltage-Max:

    80 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JEDEC-95 Code:

    TO-261AA

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    1.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

  • VCEsat-Max:

    0.5 V

NSVBCP53-16T3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND9173/D for more details.
  • Ensure the device operates within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Follow the ESD handling precautions outlined in the onsemi ESD Protection Application Note (AND8033/D). Use an ESD wrist strap or mat, and handle the device by the body or leads, not the pins.
  • Yes, the NSVBCP53-16T3G is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines to maintain reliability.
  • Check the input voltage, output voltage, and current consumption. Verify the input capacitor values and layout. Consult the datasheet and application notes for specific troubleshooting guidelines.

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