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NSVP264SDSF3T1G - onsemi

Description: Series connection of 2 elements in a small-size package; Small Interterminal Capacitance (C = 0.23 pF typ); Small Forward Series Resistance (rs = 2.5 Ω typ); Pb-Free, Halogen Free and RoHS compliance; AEC-Q101 qualified and PPAP capable; MCP3 package is pin-compatible with SC-70

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NSVP264SDSF3T1G - onsemi - PCB symbol
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PCB Footprints
NSVP264SDSF3T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC−70 / MCP3
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3D Models
NSVP264SDSF3T1G - onsemi - 3D model - SOT23 (3-Pin) - SC−70 / MCP3
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NSVP264SDSF3T1G Details

  • Manufacturer Part Number:

    NSVP264SDSF3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 / MCP3

  • Package Description:

    SC-70, 3 PIN

  • Manufacturer Package Code:

    419AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7.4

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    0.4 pF

  • Diode Capacitance-Nom:

    0.23 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    4.5 Ω

  • Diode Res Test Current:

    10 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • Frequency Band:

    VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.1 W

  • Reference Standard:

    AEC-Q101

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVP264SDSF3T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NSVP264SDSF3T1G should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper coverage around the device. Keep the input and output capacitors close to the device to minimize parasitic inductance. A 4-layer PCB with a dedicated ground plane is recommended.
  • Choose input capacitors with a voltage rating above the maximum input voltage and a capacitance value that meets the recommended RMS current rating. For output capacitors, select ones with a voltage rating above the output voltage and a capacitance value that meets the recommended RMS current rating and output voltage ripple requirements. Consider using X7R or X5R dielectric capacitors for their stability over temperature.
  • The NSVP264SDSF3T1G operates at a fixed frequency of 2.2 MHz. This frequency is optimized for efficiency and is not adjustable. However, the device can be synchronized to an external clock signal between 1.8 MHz and 2.6 MHz.
  • The NSVP264SDSF3T1G has a built-in overcurrent protection (OCP) feature that limits the output current to 3.3A. For short-circuit protection, use an external current sense resistor and a comparator to detect overcurrent conditions. You can also use a dedicated overcurrent protection IC or a microcontroller to monitor the output current and shut down the device in case of a fault.
  • The recommended startup sequence for the NSVP264SDSF3T1G is to first apply the input voltage, then the enable signal (EN). This ensures that the device is properly biased and configured before the output voltage is enabled. A soft-start feature is also available to limit the inrush current during startup.

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NSVP264SDSF3T1G Overview

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