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NSVR02100HT1G - onsemi

Description: Fast Switching Speed Low Leakage Current Low Forward Voltage − 0.45 V @ IF = 1 mAdc Surface Mount Device Low Capacitance Diode NSVR Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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Symbol
NSVR02100HT1G - onsemi - PCB symbol
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PCB Footprints
NSVR02100HT1G - onsemi PCB footprint - Other - Other - SOD-323-1
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3D Models
NSVR02100HT1G - onsemi - 3D model - Other - SOD-323-1
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NSVR02100HT1G Details

  • Manufacturer Part Number:

    NSVR02100HT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323

  • Package Description:

    SOD-323, 2 PIN

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2016-12-16

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    100 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Reverse Current-Max:

    0.15 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVR02100HT1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. A thermal pad on the bottom of the package can be connected to a thermal plane or a heat sink for improved thermal management.
  • Use a shielded enclosure, keep sensitive analog circuits away from the NSVR02100HT1G, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Ensure proper grounding and decoupling of the device.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a voltage rating of 25V or higher for input and output capacitors. Place them as close to the device as possible to minimize parasitic inductance.
  • Implement overvoltage protection using a voltage supervisor or a dedicated overvoltage protection IC. For fault detection, monitor the device's output voltage and current, and implement a fault detection circuit to detect anomalies and trigger a shutdown or alarm.
  • Derate the device's power dissipation by 1.5% per degree Celsius above 25°C. Ensure the device operates within the recommended junction temperature range of -40°C to 150°C.

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NSVR02100HT1G Overview

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