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NSVR201MXT5G - onsemi

Description: Less Parasitic Components; Small Forward Voltage; Small-sized Package; Pb-Free and RoHS compliance; AEC-Q101 qualified and PPAP capable; Small Interterminal Capacitance

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Symbol
NSVR201MXT5G - onsemi - PCB symbol
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PCB Footprints
NSVR201MXT5G - onsemi PCB footprint - Other - Other - X2DFN2 1.0x0.6, 0.65P CASE 714AB ISSUE B
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3D Models
NSVR201MXT5G - onsemi - 3D model - Other - X2DFN2 1.0x0.6, 0.65P CASE 714AB ISSUE B
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NSVR201MXT5G Details

  • Manufacturer Part Number:

    NSVR201MXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.32 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.05 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    2 V

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVR201MXT5G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a shielded enclosure or a metal can package to minimize EMI. Ensure that the device is placed away from noise sources and that the PCB layout is designed to minimize radiation. Use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for output filtering. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.

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NSVR201MXT5G Overview

Use the download button to access the NSVR201MXT5G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NSVR2, or try a keyword search, such as Rectifier Diodes

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