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NSVRB521S30T5G - onsemi

Description: Low Forward Voltage Drop ; Low Reverse Current; Flat Lead, Surface Mount Device Under 0.70 mm Height; Extremely Small Outline Plastic Package SOD-523; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NSVRB521S30T5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−523_A
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3D Models
NSVRB521S30T5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD−523_A
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NSVRB521S30T5G Details

  • Manufacturer Part Number:

    NSVRB521S30T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523-2

  • Package Description:

    SOD-523, 2 PIN

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-08-22

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVRB521S30T5G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat effectively.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate heat sinking and airflow around the device.
  • The NSVRB521S30T5G has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
  • Yes, the NSVRB521S30T5G is suitable for high-reliability and automotive applications, as it meets the relevant industry standards and has been qualified for use in these environments. However, it's essential to consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
  • The recommended soldering and assembly techniques for the NSVRB521S30T5G include using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended soldering profile and assembly guidelines provided in the datasheet or onsemi's application notes.

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NSVRB521S30T5G Overview

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