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NSVRB751S40T1G - onsemi

Description: Extremely Fast Switching Speed; Extremely Low Forward Voltage: 0.28 V (Typ) @ IF = 1.0 mAdc; Low Reverse Current; Lead−Free Plating; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NSVRB751S40T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−523__
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3D Models
NSVRB751S40T1G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD−523__
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NSVRB751S40T1G Details

  • Manufacturer Part Number:

    NSVRB751S40T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523-2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.37 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.03 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVRB751S40T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal management, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • The maximum allowed voltage transient on the input pins is ±500 mV, with a duration of less than 100 ns. Exceeding this may cause damage to the device.
  • Yes, the NSVRB751S40T1G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, additional testing and validation may be required for specific use cases.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but it's still important to handle the device by the body or use an ESD wrist strap to prevent damage.

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NSVRB751S40T1G Overview

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