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NT3H1101W0FTTJ - NXP

Description: NXP - NT3H1101W0FTTJ - RFID IC, NTAG, 13.56 MHz, Read, Write, 1KB, 106 Kbit/s, I2C, 1.8 V to 3.6 V, TSSOP-8

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PCB Footprints
NT3H1101W0FTTJ - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8
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NT3H1101W0FTTJ - NXP  - 3D model - Small Outline Packages - TSSOP8
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NT3H1101W0FTTJ Details

  • Manufacturer Part Number:

    NT3H1101W0FTTJ

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT505-1

  • HTS Code:

    8542.32.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.2

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT3H1101W0FTTJ Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the NT3H1101W0FTTJ is 1.71V to 1.89V.
  • To ensure proper power-on, apply a stable voltage supply, and ensure the power-on reset (POR) circuit is functioning correctly. Also, check that the voltage supply ramps up slowly (typically 1-10 ms) to prevent damage.
  • The maximum operating frequency of the NT3H1101W0FTTJ is 100 MHz.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at extreme temperatures (above 85°C or below -40°C).
  • For optimal performance, use a 4-layer PCB with a solid ground plane, keep signal traces short and away from noise sources, and use decoupling capacitors near the device.

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NT3H1101W0FTTJ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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