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NT3H2111W0FHKH - NXP

Description: RFID Transponders BL SECURE MOBILE TRANSACTIONS

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Symbol
NT3H2111W0FHKH - NXP - PCB symbol
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PCB Footprints
NT3H2111W0FHKH - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - XQFN8 SOT902-3
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3D Models
NT3H2111W0FHKH - NXP - 3D model - Quad Flat No-Lead - XQFN8 SOT902-3
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NT3H2111W0FHKH Details

  • Manufacturer Part Number:

    NT3H2111W0FHKH

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    XQFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT902-3

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.32.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PQCC-N8

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC8,.07SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.67 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT3H2111W0FHKH Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified temperature range (-40°C to 150°C) and consider derating the device for high-temperature applications.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag or container.
  • Yes, the NT3H2111W0FHKH is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions, and consider additional testing and validation for your specific use case.
  • Start by reviewing the datasheet and application notes. Check for proper PCB layout, thermal management, and power supply decoupling. Use oscilloscopes and logic analyzers to debug signal integrity issues. Consult NXP's technical support resources or contact a local FAE for further assistance.

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NT3H2111W0FHKH Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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