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NTB0104GU12,115 - NXP

Description: Voltage Level Translator 4-CH Bidirectional 12-Pin XQFN T/R

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PCB Footprints
NTB0104GU12,115 - NXP PCB footprint - Other - Other - SOT1174-1 (XQFN12)-1
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3D Models
NTB0104GU12,115 - NXP  - 3D model - Other - SOT1174-1 (XQFN12)-1
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NTB0104GU12,115 Details

  • Manufacturer Part Number:

    NTB0104GU12,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    XQFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    SOT1174-1

  • Country Of Origin:

    Taiwan, Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Additional Feature:

    ALSO REQUIRES 1.65V TO 5.5V SUPPLY

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    NTB0104

  • JESD-30 Code:

    R-PQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    REGISTERED BUS TRANSCEIVER

  • Max I(ol):

    0.00002 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC12,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    14.2 ns

  • Propagation Delay (tpd):

    14.2 ns

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.7 mm

NTB0104GU12,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for NTB0104GU12,115 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure EMC with NTB0104GU12,115, follow proper PCB design guidelines, use shielding, and implement filtering and shielding on the input and output lines. Additionally, ensure that the device is properly grounded and that the system is designed to meet relevant EMC standards.
  • For thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the recommended thermal pad layout. The device's junction temperature should not exceed 150°C, and the storage temperature should be between -55°C and 150°C.
  • Yes, NTB0104GU12,115 is suitable for high-reliability and safety-critical applications. However, it's essential to follow NXP's guidelines for reliability and safety, and to perform thorough testing and validation to ensure the device meets the specific application requirements.
  • To troubleshoot issues with NTB0104GU12,115, start by checking the power supply, signal integrity, and PCB layout. Use oscilloscopes and logic analyzers to debug the issue. Consult NXP's application notes and technical support resources for guidance on troubleshooting specific issues.

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NTB0104GU12,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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