NTC0805J30K - TE Connectivity

NTC0805J30K Frequently Asked Questions (FAQs)

• What is the thermal resistance of the NTC0805J30K?
  The thermal resistance of the NTC0805J30K is typically around 10-15 K/W, but this can vary depending on the specific application and mounting method.
• How do I handle the NTC0805J30K during soldering to prevent damage?
  To prevent damage during soldering, it's recommended to use a low-temperature soldering profile (below 260°C) and avoid applying excessive heat or mechanical stress to the component.
• Can I use the NTC0805J30K in a high-vibration or high-shock environment?
  While the NTC0805J30K is a robust component, it's still a ceramic-based device and may not be suitable for extremely high-vibration or high-shock environments. TE Connectivity recommends consulting their application notes and performing thorough testing before using the component in such environments.
• How accurate is the temperature measurement of the NTC0805J30K?
  The NTC0805J30K has a typical accuracy of ±1% over the operating temperature range of -40°C to 150°C. However, this can vary depending on the specific application and calibration method used.
• Can I use the NTC0805J30K in a humid or wet environment?
  The NTC0805J30K is not hermetically sealed and may not be suitable for use in humid or wet environments. TE Connectivity recommends consulting their application notes and performing thorough testing before using the component in such environments.