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NTCS0402E3103FL1T - Vishay

Description: NTC Thermistors 10Kohm 1% SMD

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NTCS0402E3103FL1T - Vishay PCB footprint - Thermistors Chip - Thermistors Chip - NTCS0402E3.....T
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NTCS0402E3103FL1T - Vishay  - 3D model - Thermistors Chip - NTCS0402E3.....T
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NTCS0402E3103FL1T Details

  • Manufacturer Part Number:

    NTCS0402E3103FL1T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8.8

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER

  • Rated Power Dissipation (P):

    0.07 W

  • Rated Temperature:

    25 °C

  • Reference Standard:

    AEC-Q200; CUL, UL

  • Resistance:

    10000 Ω

  • Resistor Type:

    NTC THERMISTOR

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermal Sensitivity Index:

    3490 K

  • Thermistor Application:

    TEMPERATURE SENSING

  • Tolerance:

    1%

NTCS0402E3103FL1T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the NTCS0402E3103FL1T is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape.
  • The NTCS0402E3103FL1T has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
  • The recommended soldering profile for the NTCS0402E3103FL1T is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C.
  • Yes, the NTCS0402E3103FL1T is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure proper mounting and soldering to prevent mechanical stress.
  • To ensure reliability in a humid environment, follow the manufacturer's guidelines for moisture sensitivity level (MSL) and ensure proper storage and handling procedures. Additionally, consider using a conformal coating or potting compound to protect the component from moisture.

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