The recommended land pattern for the NTCS0603E3104HXT is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0603E3104HXT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The NTCS0603E3104HXT has an MSL rating of 1, which means it can withstand normal humidity levels without special handling or storage requirements.
Yes, the NTCS0603E3104HXT is suitable for high-reliability applications due to its high-quality materials and manufacturing process, which ensure a low failure rate and high performance over time.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid overheating the component and ensure good solder wetting.
Trust Checks
This model has been verified by system checks.
System Verified
Sponsored
NTCS0603E3104HXT Overview
Use the download button to access the NTCS0603E3104HXT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NTCS0,
or try a keyword search, such as Non-linear Resistors
