The recommended land pattern for the NTCS0805E3104FMT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3104FMT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The maximum operating voltage for the NTCS0805E3104FMT is 10 V. Exceeding this voltage may damage the component.
Store the NTCS0805E3104FMT in a dry, cool place, away from direct sunlight and moisture. Use a dry pack or airtight container with desiccant to maintain a relative humidity of 20% or less.
The recommended soldering profile for the NTCS0805E3104FMT is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Avoid exceeding 280°C to prevent damage to the component.
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NTCS0805E3104FMT Overview
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