The recommended land pattern for NTCS0805E3104HXT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While NTCS0805E3104HXT is rated for operation up to 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. This is because the component's reliability and accuracy may be compromised above this temperature.
NTCS0805E3104HXT is an ESD-sensitive component. To handle it safely, use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the component's pins or body, and use anti-static packaging and handling materials.
Store NTCS0805E3104HXT in a dry, cool place with a temperature range of 20°C to 30°C and relative humidity below 60%. Avoid storing the component in direct sunlight or near sources of moisture, heat, or radiation.
While NTCS0805E3104HXT is not hermetically sealed, it is designed to operate in a normal humidity environment (RH < 60%). However, it's not recommended to use it in extremely humid environments (RH > 80%) or in applications where condensation may occur.
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NTCS0805E3104HXT Overview
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