The recommended land pattern for the NTCS0805E3104SMT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3104SMT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The recommended soldering profile for the NTCS0805E3104SMT is a reflow soldering process with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/second.
Yes, the NTCS0805E3104SMT is compatible with lead-free soldering. It is RoHS-compliant and can be soldered using lead-free soldering processes.
The NTCS0805E3104SMT has a moisture sensitivity level (MSL) of 3, which means it can withstand exposure to moisture for up to 168 hours without damage.
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NTCS0805E3104SMT Overview
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