NTCS0805E3153HMT - Vishay

NTCS0805E3153HMT Frequently Asked Questions (FAQs)

• What is the recommended land pattern for NTCS0805E3153HMT?
  The recommended land pattern for NTCS0805E3153HMT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use NTCS0805E3153HMT in a high-temperature application?
  NTCS0805E3153HMT is rated for operation up to 150°C, but it's not recommended to use it in applications above 125°C for extended periods. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
• How do I handle the NTCS0805E3153HMT during PCB assembly to prevent damage?
  Handle the NTCS0805E3153HMT by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the component during assembly.
• What is the recommended soldering profile for NTCS0805E3153HMT?
  The recommended soldering profile for NTCS0805E3153HMT is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of component damage.
• Can I use NTCS0805E3153HMT in a humid or moist environment?
  NTCS0805E3153HMT is not hermetically sealed, so it's not recommended for use in humid or moist environments. Moisture can ingress into the component and affect its performance and reliability. If you need to use it in a humid environment, consider applying a conformal coating or using a hermetically sealed component.