The recommended land pattern for the NTCS0805E3222GMT is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
To handle thermal considerations, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal pad size is 2.5 mm x 2.5 mm, with a minimum of 5 thermal vias with a diameter of 0.3 mm.
The maximum operating temperature range for the NTCS0805E3222GMT is -55°C to +150°C. However, the component's accuracy and stability may degrade above 125°C. It's essential to consider the application's temperature requirements and ensure the component operates within its specified range.
To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a soldering flux with a moderate activity level. The recommended soldering time is 2-3 seconds, with a peak temperature of 240°C. Avoid using excessive soldering force, which can damage the component.
The recommended storage condition for the NTCS0805E3222GMT is in a dry, cool place with a temperature range of 20°C to 30°C and relative humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
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NTCS0805E3222GMT Overview
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