The recommended land pattern for the NTCS0805E3223FHT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3223FHT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The recommended soldering profile for the NTCS0805E3223FHT is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C.
Yes, the NTCS0805E3223FHT is suitable for use in high-vibration environments, but ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.
To ensure reliability in a humid environment, ensure that the NTCS0805E3223FHT is stored in a dry environment, and consider using a conformal coating or potting compound to protect the component from moisture.
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NTCS0805E3223FHT Overview
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