The recommended land pattern for NTCS0805E3472GMT is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
NTCS0805E3472GMT is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for specific derating guidelines.
The thermal pad of NTCS0805E3472GMT should be connected to a copper plane on the PCB to ensure proper heat dissipation. A thermal via or a thermal pad connection to a ground plane is recommended.
Yes, NTCS0805E3472GMT is compatible with lead-free soldering processes, such as SAC305 or Sn96.5Ag3Cu0.5. However, the recommended soldering temperature profile should be followed to ensure reliable assembly.
NTCS0805E3472GMT has a moisture sensitivity level (MSL) of 1, which means it can be exposed to a maximum of 30°C/60% RH for 168 hours before soldering.
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