The recommended land pattern for the NTCS0805E3473FHT is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3473FHT has a thermal resistance of 350°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The recommended soldering profile for the NTCS0805E3473FHT is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C.
Yes, the NTCS0805E3473FHT is compatible with lead-free soldering. It is RoHS-compliant and can be soldered using lead-free soldering processes.
The NTCS0805E3473FHT has a moisture sensitivity level (MSL) of 3, which means it can withstand exposure to moisture for up to 168 hours without damage.
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NTCS0805E3473FHT Overview
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