The recommended land pattern for NTCS0805E3473GHT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
NTCS0805E3473GHT is rated for operation up to 150°C, but it's not recommended to use it in applications above 125°C for extended periods. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
Handle NTCS0805E3473GHT by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage.
The recommended soldering profile for NTCS0805E3473GHT is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of thermal damage.
NTCS0805E3473GHT is not designed for use in humid or corrosive environments. It's recommended to use conformal coating or potting to protect the component from moisture and contaminants.
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NTCS0805E3473GHT Overview
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