The recommended land pattern for the NTCS0805E3473HHT is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3473HHT has a thermal resistance of 350°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The recommended soldering profile for the NTCS0805E3473HHT is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C.
Yes, the NTCS0805E3473HHT is compatible with lead-free soldering. It is RoHS-compliant and can be soldered using lead-free soldering processes.
The NTCS0805E3473HHT has an MSL rating of 1, which means it can withstand normal humidity levels and does not require special handling or storage.
Trust Checks
This model has been generated by a fully automated process.
Machine Generated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NTCS0805E3473HHT Overview
Use the download button to access the NTCS0805E3473HHT schematic symbol, PCB footprint, and 3D model.