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NTMC083NP10M5L - onsemi

Description: Small Footprint (5 x 6 mm) for Compact Design; Low RDS(on) to Minimize Conduction Losses; Low QG and Capacitance to Minimize Driver Losses; The Part is Not ESD Protected; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NTMC083NP10M5L - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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NTMC083NP10M5L - onsemi  - 3D model - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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NTMC083NP10M5L Details

  • Manufacturer Part Number:

    NTMC083NP10M5L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.75

  • Avalanche Energy Rating (Eas):

    18 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    4.1 A

  • Drain-source On Resistance-Max:

    0.083 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2.6 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    3.1 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMC083NP10M5L Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTMC083NP10M5L is a 3.3mm x 3.3mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design guidelines.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal vias, and ensuring good airflow around the device.
  • The maximum allowed voltage on the input pins of NTMC083NP10M5L is 5.5V, which is the absolute maximum rating. However, it is recommended to operate the device within the recommended operating conditions specified in the datasheet to ensure reliable operation.
  • Yes, NTMC083NP10M5L is compatible with 3.3V systems. The device is specified to operate from a single 3.0V to 5.5V supply, making it suitable for use in 3.3V systems.
  • NTMC083NP10M5L has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage to the device. This includes using ESD-safe materials, grounding straps, and wrist straps, and storing the devices in ESD-safe packaging.

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