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NTMFS022N15MC - onsemi

Description: Low RDS(on); Low QG and Capacitance; RoHS Compliant; Lowers Switching noise /EMI; MSL1 Robust Package Design; 100% UIL Tested; ROHS Compliant

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PCB Footprints
NTMFS022N15MC - onsemi PCB footprint - Other - Other - Power 56  (PQFN8) CASE 483AE
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3D Models
NTMFS022N15MC - onsemi  - 3D model - Other - Power 56  (PQFN8) CASE 483AE
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NTMFS022N15MC Details

  • Manufacturer Part Number:

    NTMFS022N15MC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    QFN-8

  • Manufacturer Package Code:

    483AE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    43 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Avalanche Energy Rating (Eas):

    96 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    41.9 A

  • Drain-source On Resistance-Max:

    0.022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6 pF

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    80.6 W

  • Pulsed Drain Current-Max (IDM):

    183 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS022N15MC Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Also, ensure proper thermal design, including heat sinking and airflow, to keep the device within the specified temperature range.
  • The NTMFS022N15MC has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
  • Yes, the NTMFS022N15MC is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is used within the specified temperature range and electrical parameters. Additionally, consider using a device with a higher temperature rating, such as the NTMFS022N15MCX, for more demanding applications.
  • The optimal gate resistor value depends on the specific application, including the switching frequency, voltage, and current. A general guideline is to use a gate resistor value between 10 ohms and 100 ohms. However, it's recommended to consult the application note or seek guidance from onsemi's technical support team for more specific guidance.

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NTMFS022N15MC Overview

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