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NTMFS1D15N03CGT1G - onsemi

Description: Wide SOA; Ultra Low RDS(on); Advanced SO8FL 5x6mm Package

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PCB Footprints
NTMFS1D15N03CGT1G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2
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3D Models
NTMFS1D15N03CGT1G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2
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NTMFS1D15N03CGT1G Details

  • Manufacturer Part Number:

    NTMFS1D15N03CGT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2019-09-13

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    354 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    245 A

  • Drain-source On Resistance-Max:

    0.00115 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    99 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    124 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS1D15N03CGT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for good airflow.
  • To ensure proper biasing, follow the recommended operating conditions in the datasheet, including the correct voltage supply, current limits, and gate-source voltage. Additionally, consider using a gate driver or a voltage regulator to maintain a stable bias voltage.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, increased power consumption, and potentially even device failure. It's essential to ensure the device operates within the specified temperature range to maintain reliability and performance.
  • To protect the device from ESD, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and packaging materials. Additionally, consider implementing ESD protection circuits or devices in your design.
  • The reliability and lifespan of the NTMFS1D15N03CGT1G depend on various factors, including operating conditions, environmental factors, and manufacturing quality. Onsemi provides reliability data and guidelines in the datasheet and application notes. It's essential to follow recommended operating conditions and design guidelines to ensure optimal reliability and lifespan.

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NTMFS1D15N03CGT1G Overview

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