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NTMFS4C022NT1G - onsemi

Description: Small Footprint (5x6 mm) for Compact Design; Low RDS(on) to Minimize Conduction Losses; Low QG and Capacitance to Minimize Driver Losses; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NTMFS4C022NT1G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2
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3D Models
NTMFS4C022NT1G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2
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NTMFS4C022NT1G Details

  • Manufacturer Part Number:

    NTMFS4C022NT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    488AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2016-06-01

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    549 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    136 A

  • Drain-source On Resistance-Max:

    0.0024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    67 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    352 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTMFS4C022NT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTMFS4C022NT1G is a 2x2mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design to ensure reliable assembly and thermal performance.
  • To ensure reliable operation of NTMFS4C022NT1G in high-temperature environments, it is recommended to follow the thermal design guidelines provided in the datasheet, including proper heat sinking, thermal interface material selection, and PCB design considerations.
  • The maximum allowed voltage for NTMFS4C022NT1G is 20V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
  • To handle ESD protection for NTMFS4C022NT1G, it is recommended to follow proper ESD handling procedures during assembly and testing, and to use ESD protection devices such as TVS diodes or ESD arrays in the circuit design.
  • The recommended operating frequency range for NTMFS4C022NT1G is up to 100 MHz, as specified in the datasheet. Operating the device outside of this range may affect its performance and reliability.

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