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NTMFS5H425NLT1G - onsemi

Description: Low RDS(on); Low input capacitance; RoHS Compliant

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PCB Footprints
NTMFS5H425NLT1G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2022-2
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NTMFS5H425NLT1G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2022-2
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NTMFS5H425NLT1G Details

  • Manufacturer Part Number:

    NTMFS5H425NLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN-5

  • Manufacturer Package Code:

    488AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2018-12-13

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    289 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    118 A

  • Drain-source On Resistance-Max:

    0.0043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    69 W

  • Pulsed Drain Current-Max (IDM):

    650 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTMFS5H425NLT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would involve placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Make sure to provide a stable voltage supply, and use a suitable bias resistor and capacitor values to ensure the device is operating within its recommended operating range.
  • To mitigate EMI and RFI, use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure proper PCB layout and grounding, and use EMI-absorbing materials if necessary.
  • To handle overvoltage protection, use a voltage regulator or a transient voltage suppressor (TVS) diode to clamp the voltage to a safe level. You can also use a fuse or a polyfuse to protect against overcurrent conditions.
  • The NTMFS5H425NLT1G has a typical lifespan of 10-15 years, depending on operating conditions and usage. It's designed to meet the reliability standards of the automotive industry, with a failure rate of less than 10 FIT (failures per billion hours) at 125°C.

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NTMFS5H425NLT1G Overview

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