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NTMFSC004N08MC - onsemi

Description: MOSFET - Power, Single N-Channel, DUAL COOL , DFN8 80 V, 4.0 m, 136 A

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NTMFSC004N08MC - onsemi PCB footprint - Other - Other - NTMFSC004N08MC-3
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NTMFSC004N08MC - onsemi  - 3D model - Other - NTMFSC004N08MC-3
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NTMFSC004N08MC Details

  • Manufacturer Part Number:

    NTMFSC004N08MC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    SO-8FL, DFN5, 8 PIN

  • Manufacturer Package Code:

    506EG

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    178 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    136 A

  • Drain-source On Resistance-Max:

    0.004 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    127 W

  • Pulsed Drain Current-Max (IDM):

    487 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFSC004N08MC Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTMFSC004N08MC is a 5x5mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design guidelines.
  • To ensure reliable operation of NTMFSC004N08MC in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal vias, and ensuring good airflow around the device.
  • The maximum allowed voltage on the input pins of NTMFSC004N08MC is 5.5V, which is the absolute maximum rating. However, it is recommended to operate the device within the recommended operating conditions specified in the datasheet to ensure reliable operation.
  • Yes, NTMFSC004N08MC is suitable for high-frequency applications up to 1 GHz. However, it is recommended to follow proper layout and design guidelines to minimize parasitic inductance and capacitance, and to ensure good signal integrity.
  • NTMFSC004N08MC has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage to the device. This includes using ESD-safe materials, grounding straps, and following proper handling and storage procedures.

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NTMFSC004N08MC Overview

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