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NTMTS001N06CLTXG - onsemi

Description: Small Footprint (8x8 mm); Low RDS(on); Low QG and Capacitance; RoHS Compliant

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PCB Footprints
NTMTS001N06CLTXG - onsemi PCB footprint - Other - Other - DFNW8 8.3x8.4, 2P CASE 507AP ISSUE O
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3D Models
NTMTS001N06CLTXG - onsemi  - 3D model - Other - DFNW8 8.3x8.4, 2P CASE 507AP ISSUE O
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NTMTS001N06CLTXG Details

  • Manufacturer Part Number:

    NTMTS001N06CLTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Manufacturer Package Code:

    507AP

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2019-01-23

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    887 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    398.2 A

  • Drain-source On Resistance-Max:

    0.00105 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    130 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    244 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTMTS001N06CLTXG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for NTMTS001N06CLTXG is -55°C to 150°C.
  • To ensure optimal performance, the device should be biased with a Vgs of 10V and a Vds of 60V, with a maximum current of 1A.
  • A recommended PCB layout for NTMTS001N06CLTXG includes a thermal pad for heat dissipation, and a minimum of 2oz copper thickness for the PCB. Thermal management should include a heat sink with a thermal resistance of 1°C/W or lower.
  • To protect NTMTS001N06CLTXG from ESD, handle the device with an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or leads.
  • NTMTS001N06CLTXG meets the reliability and quality standards of onsemi, including AEC-Q101 and ISO/TS 16949 certifications.

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NTMTS001N06CLTXG Overview

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